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| Microwave Ceramics and Modules 3-Pole Filter for WSP Preliminary Data Sheet Filter B69813N1477A840 Features SMD filter consisting of coupled resonators with stepped impedances (NdBa)TiO3 (r = 88 / TCf = 010 ppm/K) with a coating of copper (10m) and tin (>5m) Excellent reflow solderability, no migration effect due to copper/tin metallization Index Page 2 * Component drawing * Recommended footprint Page 3 * Characteristics * Maximum ratings * Typical passband characteristic Page 4 * Processing information * Soldering requirements * Delivery mode ISSUE DATE 19.03.04 ISSUE P5 PUBLISHER SAW MWC PD PAGE 1/4 Microwave Ceramics and Modules 3-Pole Filter for WSP Preliminary Data Sheet Component drawing Filter B69813N1477A840 View from below onto the solder terminals and view from beside Recommended footprint I/O G G G I/O G ISSUE DATE 19.03.04 ISSUE P5 PUBLISHER SAW MWC PD PAGE 2/4 Microwave Ceramics and Modules 3-Pole Filter for WSP Preliminary Data Sheet Filter B69813N1477A840 Characteristics min. Center frequency Insertion loss Passband 1dB Bandwidth Amplitude ripple (peak - peak) Standing wave ratio Impedance Attenuation DC to 1262 MHz at 1262 to 1350 MHz at 1350 to 1380 MHz at 1380 to 1400 Mhz at 1660 MHz Maximum ratings IEC climatic category (IEC 68-1) Operating temperature Typical passband characteristic 1 1.04 1.08 1.12 1.16 1.2 1.24 1.28 1.32 1.36 1.4 1.44 1.48 1.52 1.56 1.6 1.64 1.68 1.72 1.76 1.8 - 40/+ 90/56 Top - 20 / + 85 C SWR Z 40 30 25 15 30 fc IL B 40 60 0.3 1.5 50 47 35 28 18 31 1.0 2.0 dB dBc dB dB dBc typ. 1472 1.8 max. 2.3 MHz dB MHz MHz dB 0 attenuation [dB] -10 -20 -30 -40 -50 -60 DB[S11] DB[S21] frequency [GHz] ISSUE DATE 19.03.04 ISSUE P5 PUBLISHER SAW MWC PD PAGE 3/4 Microwave Ceramics and Modules 3-Pole Filter for WSP Preliminary Data Sheet Processing information Wettability acc. to IEC 68-2-58: 75% (after aging) Soldering Requirements Profile for eutectic SnPb solder paste Soldering type reflow Maximum soldering temperature 235 (max. 2 sec.) (measuring point on top surface of the component) 225 (max. 10 sec.) Recommended soldering conditions (infrared): Temp. [C] within 10 sec. Filter B69813N1477A840 Profile for leadfree solder paste reflow 260 (max. 2 sec.) C 250 (max. 10 sec.) C Temp. [C] within 10 sec. 215C10C 245C5C 20-40 sec. 40-80 sec. Time [sec.] 30 sec. 2.5 C/s 2-3 min. Time [sec.] > - 5 C/s Delivery mode Blister tape to IEC 286-3, polystyrol, grey Pieces/tape: 1500 Tape: Profile B-B: Reel: I/O A Profile A-A: B B A direction of unreeling EPCOS AG 2001. All Rights Reserved. Reproduction, publication and dissemination of this data sheet, enclosures hereto and the information contained therein without EPCOS' prior express consent is prohibited. The information contained in this data sheet describes the type of component and shall not be considered as guaranteed characteristics. Purchase orders are subject to the General Conditions for the Supply of Products and Services of the Electrical and Electronics Industry recommended by the ZVEI (German Electrical and Electronic Manufacturers' Association), unless otherwise agreed. ISSUE DATE 19.03.04 ISSUE P5 PUBLISHER SAW MWC PD PAGE 4/4 |
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